Completed
Adhesion & Joining Expo Osaka 2021
Organizer:
Reed Exhibitions Japan Ltd.
Duration:
Jun 23 - 25, 2021
Venue:
INTEX Osaka
Location:
Japan
Website:
Industry Focus:
Introduction:
Joining Osaka is a specialising show gathering various kinds of "adhesion & joining technology" essential to a wide range of industries including automobile, electronics, construction and more. It widely covers materials such as adhesive and gluing agents, as well as joining equipment and technologies such as FSW, ultrasonic welding, and diffusion welding.