Stainless 2027
Organizer:
BVV Trade Fairs Brno
Duration:
TBD
Venue:
Brno Exhibition Centre
Location:
Czech Republic
Industry Focus:
Introduction:
The Wafer-Level Packaging Symposium will bring together the semiconductor industry's most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies.
Addressing wafer-level packaging, 3D, and Advanced Manufacturing & Test technologies, the Wafer-Level Packaging Symposium will be at the forefront of packaging technology evolution. The conference will feature attendees from around the globe in the heart of Silicon Valley to immerse themselves in the latest technology and business trends.