2017 HKPCA & IPC Show Coming in December
Date: Sep 13,2017
From: 2017 HKPCA & IPC Show
New Highlights at the World’s Largest PCB & EA Show
Lots of Innovations to be displayed at this year’s Leading PCB Industry Trade Show
(Hong Kong, 11 September 2017) In addition to the return of the PCB industry’s leading players, the 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show) will feature many new elements: First-time exhibitors, innovative products and services and the entirely new Hong Kong Pavilion. The show will again be staged at the Shenzhen Convention & Exhibition Center, China, running from 6 to 8 December 2017.
More exhibitors than ever before – Many new exhibitors debut, previously unseen offerings
With close to 550 confirmed exhibitors representing every segment of the PCB industry’s supply chain and taking up more than 2, 600 booths, this year’s show shatters all previous records. Among the exhibitors occupying over 52, 500 sq. M. Of exhibition space across Halls 1, 2 & 4 of the Shenzhen Convention & Exhibition Center, over 90 of them are new to this year’s show (as of 31 August), bringing with them fresh ideas and creative market offerings. New exhibitors include Huizhou Zhending, Baldor-tech, PolarLight, Gigavis, Orchem, Guangzhou HongTai, Jaguar, Huazheng, Yegao Chemical, Xilu, Ming-Hao, and many more.
Both new and old exhibitors will be bringing the latest 2017-launch innovations to the show. Famous brands with new offerings at the show include World Mastery, Joint Stars, Universal P. C. B., Rogers, Micronic, Harvar, Uyemura, Guangdong Zhengye, ABQ Chemicals, JCU, and more. In the words of Dr. John W. Mitchell, President & CEO, IPC – Association Connecting Electronics Industries®: “The show has long been recognized within the industry as the ideal platform for sourcing. The profusion of new offerings makes attendance at the HKPCA & IPC Show the most convenient way for industry participants to keep up with the latest up-to-the-minute developments and technologies which are transforming the future of PCB manufacturing. ”
Hong Kong Pavilion – a new highlight of the show
Also new to this year’s show is the Hong Kong Pavilion. Presented with co-organizers the Hong Kong Productivity Council, the Hong Kong Pavilion comprises 100sq. M. Of common area surrounded by PCB manufacturers’ booths. The common area will be partitioned into separate regions showing PCB or semiconductor products and technology in four different expanding product categories: Communication, computers, consumer electronics and the automotive sector.
Mr. Canice Chung, Chairman of the Hong Kong Printed Circuit Association, remarked: “We are delighted that the new Hong Kong Pavilion will demonstrate our commitment to the highest standards of PCB manufacturing in these growth sectors – not only outstanding manufacturing technique with high value-added, but an international perspective complemented by a strong sense of social responsibility. I am confident the Pavilion will add even more value to what is already recognized as the industry’s leading annual event. ”